ARPost
OCTOBER 20, 2021
The leading OEMs such as Samsung and Apple are expected to contribute to manufacturing more AR devices. billion by the year 2028 at the CAGR of 20.6%. See Also: The ARPost Guide to 5G Internet and XR. With the launch of 5G, that prediction is going in the right direction.
The Ghost Howls
JULY 20, 2020
6G is coming to 2028–2030. While we have not even started using 5G, companies like Samsung (and Nokia) are already thinking about the next-generation 6G that could enable holograms and smart twins. According to Samsung, it should come in 2028. Smart tattoos are very cyberpunk, I would like to have one!
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Anand Tech
AUGUST 19, 2022
Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research of next-generation technologies and materials. The company plans to invest KRW 20 trillion ($15 billion) in the new R&D facility by 2028.
The Ghost Howls
FEBRUARY 5, 2025
Apple executives are planning that eventual Apple AR glasses may come in 2028 at the earliest, probably even later. Apple has a team at a secretive facility in Santa Clara that is developing microLED displays intended for AR glasses. MicroLEDs are a new type of display that is very promising for the future of XR.
XR Today - Virtual Reality
AUGUST 27, 2023
through to the year 2028. Why Do People Buy Metaverse Real Estate? Samsung created a virtual world in Decentraland, where it hosts events like the #RecycleUp Fashion show. As interest in metaverse landscapes continues to grow, digital real estate is expected to increase in value in the years ahead.
Anand Tech
FEBRUARY 14, 2024
ASML did not disclose how many High-NA EUV litho tools it plans to ship this year, but the company has already announced that it had obtained orders for these machines from all leading makers of logic chips (Intel, Samsung Foundry, TSMC) and memory (Micron, Samsung, SK Hynix), and that the total number currently stands between 10 and 20 systems.
Anand Tech
APRIL 5, 2024
The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. billion higher than advanced packaging CapEx budgets of Intel, TSMC and Samsung in 2023, based on estimates from Yole Intelligence. In fact, $3.87
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